Electronic Special Equipment Assembly and Commissioning Technician

Personnel who assemble and commission specialized process equipment and testing equipment for electronic products using equipment such as vacuum coating machines and bonding machines, as well as instruments and tools.

Project pending development

Certificate Value

  • An internationally recognized entry-level qualification in electronic special equipment assembly and commissioning, focusing on electronic process equipment assembly, vacuum coating equipment commissioning, bonding equipment operation, and testing equipment calibration; serves as a standardized professional credential in electronic equipment manufacturing.
  • Can serve as an important basis for recruitment and grading for equipment assembly, commissioning, and operation/maintenance positions in semiconductor equipment companies, electronic equipment manufacturers, and precision instrument enterprises.
  • Certification can improve electronic equipment assembly and commissioning capabilities and enhance employment competitiveness in electronic equipment manufacturing.

Target Audience

  • Current students or recent graduates majoring in Electronic Information Engineering, Mechatronics, Automation Technology, Precision Instruments, Semiconductor Engineering, or related fields.
  • Technical personnel seeking to transition into electronic special equipment assembly and commissioning and semiconductor equipment manufacturing and maintenance.
  • Junior employees in semiconductor equipment, electronic equipment manufacturing, and precision instrument enterprises engaged in assembly, commissioning, and maintenance.
  • Technical enthusiasts and entrepreneurs interested in electronic special equipment assembly and semiconductor equipment manufacturing who wish to receive systematic entry-level training and obtain certification.

Eligibility Requirements:

  1. Any one of the following:
  2. （1）At least 1 year of cumulative experience in electronic equipment assembly, vacuum equipment operation, bonding equipment commissioning, testing equipment maintenance, semiconductor equipment maintenance, or related work.
  3. （2）College diploma or above in Electronic Information Engineering, Mechatronics, Automation Technology, Precision Instruments, Semiconductor Engineering, or a related field.
  4. （3）Another Level 2 electronic equipment or manufacturing certificate certified by the China Global Professional and Technical Certification Center.

Examination Method:

  1. Theoretical examination: Computer-based or online written examination covering electronic-mechanical fundamentals, equipment principles, assembly standards, and testing standards. Duration: 90 minutes.
  2. Practical assessment: On-site practical operation, equipment assembly demonstration, and execution of commissioning procedures. Assesses equipment assembly, parameter adjustment, performance testing, and troubleshooting. Duration: 120 minutes.

Assessment Content:

  1. Theoretical Knowledge: Mechanical structure of electronic special equipment; principles of vacuum coating equipment; bonding equipment structure and operating standards; testing equipment calibration standards; maintenance and diagnosis of electronic process equipment; electromechanical control fundamentals.
  2. Operational Skills: Assemble electronic special equipment components according to process standards; adjust parameters of vacuum coating machines and bonding machines; use instruments to test equipment performance; troubleshoot and repair common equipment faults; perform equipment maintenance procedures.

Examination Enquiries:

  1. For more information, please contact: servicemy@cgptc.net

Authorised Training Provider:

马来西亚授权培训课程
Authorized training courses(Malaysia)