Semiconductor Discrete Device and Integrated Circuit Assembly & Commissioning Technician

Personnel who operate equipment for ball placement, dicing, welding and bonding to assemble and commission semiconductor discrete devices and integrated circuits.

Project pending development

Certificate Value

  • An internationally recognized entry-level qualification in semiconductor assembly and commissioning, focusing on ball placement, wafer dicing, welding/bonding and packaging commissioning; serves as a standardized professional credential in semiconductor packaging.
  • Can serve as an important basis for recruitment and grading for packaging assembly, testing/commissioning and quality inspection positions in semiconductor packaging companies, integrated circuit companies and electronic component manufacturers.
  • Certification can systematically improve semiconductor assembly, commissioning, packaging and testing capabilities and enhance employment competitiveness in semiconductor packaging.

Target Audience

  • Current students or recent graduates majoring in Microelectronics, Semiconductor Engineering, Electronic Information Engineering, Integrated Circuit Engineering, Mechatronics Engineering or related fields.
  • Technical personnel seeking to transition into semiconductor assembly and commissioning, packaging processes and testing.
  • Junior employees in semiconductor packaging, integrated circuit and electronic component manufacturing enterprises engaged in packaging assembly and testing/commissioning.
  • Technical enthusiasts and entrepreneurs interested in semiconductor assembly and packaging/testing who wish to receive systematic entry-level training and obtain certification.

Eligibility Requirements:

  1. Any one of the following:
  2. （1）At least 1 year of cumulative work experience in semiconductor packaging, ball placement, wafer dicing, welding/bonding, packaging testing or related work.
  3. （2）College diploma or above in Microelectronics, Semiconductor Engineering, Electronic Information, Integrated Circuit Engineering, Mechatronics or a related field.
  4. （3）Another Level 2 semiconductor or packaging/testing certificate certified by the China Global Professional and Technical Certification Center.

Examination Method:

  1. Theoretical examination: Computer-based or online written examination covering packaging process fundamentals, equipment principles, operating standards and quality standards. Duration: 90 minutes.
  2. Practical assessment: On-site practical operation, assembly/commissioning demonstration and testing exercises. Assesses ball placement, dicing, welding/bonding and packaging commissioning. Duration: 120 minutes.

Assessment Content:

  1. Theoretical Knowledge: Semiconductor packaging fundamentals; principles of ball placement, dicing, welding and bonding; packaging equipment structure and operating standards; integrated circuit testing methods; quality inspection standards; cleanroom and safety regulations.
  2. Operational Skills: Operate ball placement, dicing, welding and bonding equipment to assemble and commission semiconductor discrete devices and integrated circuits; execute packaging processes; use testing equipment for performance inspection; troubleshoot and repair packaging quality faults; comply with cleanroom operating standards.

Examination Enquiries:

  1. For more information, please contact: servicemy@cgptc.net

Authorised Training Provider:

马来西亚授权培训课程
Authorized training courses(Malaysia)