Semiconductor Chip Manufacturing Technician

Personnel who operate equipment such as epitaxial reactors, high-temperature oxidation/diffusion furnaces, photolithography machines and deposition systems to manufacture semiconductor discrete devices, integrated circuits and sensor chips.

Project pending development

Certificate Value

  • An internationally recognized entry-level qualification in semiconductor chip manufacturing, focusing on epitaxial growth, oxidation/diffusion, photolithography and thin-film deposition; serves as a standardized professional credential in semiconductor manufacturing.
  • Can serve as an important basis for recruitment and grading for chip manufacturing, process operation and equipment operation/maintenance positions in semiconductor manufacturers, integrated circuit companies and chip foundries.
  • Certification can systematically improve semiconductor manufacturing and process operation capabilities and enhance employment competitiveness in the semiconductor industry.

Target Audience

  • Current students or recent graduates majoring in Microelectronics, Semiconductor Physics, Materials Science and Engineering, Electronic Information Engineering, Integrated Circuit Engineering or related fields.
  • Technical personnel seeking to transition into semiconductor chip manufacturing, wafer processing and equipment operation.
  • Junior employees in semiconductor manufacturing, integrated circuit and chip foundry enterprises engaged in chip manufacturing and process operation.
  • Technical enthusiasts and entrepreneurs interested in semiconductor chip manufacturing and integrated circuit processes who wish to receive systematic entry-level training and obtain certification.

Eligibility Requirements:

  1. Any one of the following:
  2. （1）At least 1 year of cumulative work experience in semiconductor chip manufacturing, epitaxial processes, photolithography operation, thin-film deposition, wafer processing or related work.
  3. （2）College diploma or above in Microelectronics, Semiconductor Physics, Materials Science and Engineering, Electronic Information, Integrated Circuit Engineering or a related field.
  4. （3）Another Level 2 semiconductor or integrated circuit manufacturing certificate certified by the China Global Professional and Technical Certification Center.

Examination Method:

  1. Theoretical examination: Computer-based or online written examination covering semiconductor physics fundamentals, manufacturing process principles, equipment operating standards and quality standards. Duration: 90 minutes.
  2. Practical assessment: On-site practical operation, equipment operation demonstration and process parameter adjustment. Assesses epitaxial operation, photolithography, thin-film deposition and process control. Duration: 120 minutes.

Assessment Content:

  1. Theoretical Knowledge: Semiconductor physics fundamentals; epitaxial growth principles; oxidation/diffusion technology; photolithography principles and standards; thin-film deposition processes; semiconductor devices and integrated circuit fundamentals; cleanroom standards and safety requirements.
  2. Operational Skills: Operate epitaxial reactors, high-temperature oxidation/diffusion furnaces, photolithography machines and deposition systems to manufacture semiconductor discrete devices, integrated circuits and sensor chips; adjust process parameters; perform process quality inspection; troubleshoot common equipment faults; comply with cleanroom operating standards.

Examination Enquiries:

  1. For more information, please contact: servicemy@cgptc.net

Authorised Training Provider:

马来西亚授权培训课程
Authorized training courses(Malaysia)